Product Description
Layer qty: 4 layer
Material: FR-4, 1.6mm+/-10%
Copper: 1~1 oz finish
Green mask
Immersion Gold, 1u"
Min. 5mil / 5mil trace width and space, Min. Via: 10 mil
Profile: CNC routing, prototype, middle volume, mass production
E-test: 100% Fixture, vacuum package
Quality report: Solderability test, E-test report, Final inspection, RoHS compliant, Lead free, ISO 9001, UL94V-0, IPC CLASS 2
FCA HK, ex-works, express-DDU
TT in advance
| PCB Specification |
| 1 | Number of Layers | 1-16Layers |
| 2 | Max.Board Size | 508*610mm |
| 3 | Board Thickness | 0.2~4 mm |
| 4 | Min Line Width/Space | 4mil/4mil(0.1/0.1mm) |
| 5 | Min.S/M Pitch | 0.1mm(4mil) |
| 6 | Finish Hole (Mechanical) | 0.2mm--6.30mm |
| 7 | PTH Wall Thickness | >0.025mm(1mil) |
| 8 | Hole Dia.Tolerance(PTH) | ±0.075mm(3mil) |
| 9 | Hole Dia.Tolerance(NPTH) | ±0.05mm (2mil) |
| 10 | Hole Position Deviation | ±0.05mm (2mil) |
| 11 | Outline Tolerance | ±0.10mm (4mil) |
| 12 | Twist&Bow | ≤0.7% |
| 13 | Insulation Resistance | >1012Ω Normal |
| 14 | Through hole resistance | <300Ω Normal |
| 15 | Electric strength | >1.3 kv/mm |
| 16 | Current breakdown | 10A |
| 17 | Peel strength | 1.4N/mm |
| 18 | S/M abrasion | >6H |
| 19 | Thermal stress | 288 degrees20 Sec |
| 20 | Test Voltage | 50-300V |
| 21 | Min. blind/buried via | 0.2mm (8mil) |
| 22 | Available Laminates Material | FR-4, High TG FR-4(TG150,TG170), Aluminum Base, Halogen Free,Rogers(Ro4003,R04350,R6006) |
| 24 | Out Layer Copper Thickness | 1oz--5oz |
| 25 | Inner Layer Copper Thickness | 1/2oz--4oz |
| 26 | Aspect Ratio | 8:1 |
| 27 | SMT Mini. Solder Mask Width | 0.08mm |
| 28 | Mini. Solder Mask Clearance | 0.05mm |
| 29 | Plug Hole Diameter | 0.2mm--0.60mm |
| 30 | Impedance Control Tolerance | +/-10% |
| 31 | Surface Finish | HASL,HASL Leadfree,Immersion ENIG,Chem. Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
| 32 | Insulation Layer Thickness | 0.075mm--5.00mm |
| 33 | Special technology | Impedance control PCB,Blind/Buried PCB,Hard gold PCB,Aluminum PCB |
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| Trademark: |
XML |
| Model NO.: |
XML-04 |
| Shipment Terms: |
Ex-Works, Fca Hk, Express Ddu |
| Origin: |
China |
| Packing: |
Vacuum Package, Customer′s Requirement |
| Type: |
Rigid |
| Number of Layers: |
4-Layers |
| Dielectric: |
FR-4 |
| Export Markets: |
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe |
| Company: |
Shenzhen X-Mulong Circuit Co., Ltd. |