MIC Chinese Simplified Chinese Traditional English
Inquiry Basket Inquiry Basket (0) item | Recent Visit History | Join Audited Suppliers

Home » Product Directory » Electrical & Electronics » Circuit Board » 4 Layer PCB, Multilayer PCB, Immersion Gold PCB, Mass Production (XML-04)

4 Layer PCB, Multilayer PCB, Immersion Gold PCB, Mass Production (XML-04)

4 Layer PCB, Multilayer PCB, Immersion Gold PCB, Mass Production (XML-04)
4 Layer PCB, Multilayer PCB, Immersion Gold PCB, Mass Production (XML-04)

Product Description

Layer qty: 4 layer
Material: FR-4, 1.6mm+/-10%
Copper: 1~1 oz finish
Green mask
Immersion Gold, 1u"
Min. 5mil / 5mil trace width and space, Min. Via: 10 mil
Profile: CNC routing, prototype, middle volume, mass production
E-test: 100% Fixture, vacuum package
Quality report: Solderability test, E-test report, Final inspection, RoHS compliant, Lead free, ISO 9001, UL94V-0, IPC CLASS 2
FCA HK, ex-works, express-DDU
TT in advance

PCB Specification
1Number of Layers1-16Layers
2Max.Board Size508*610mm
3Board Thickness0.2~4 mm
4Min Line Width/Space4mil/4mil(0.1/0.1mm)
5Min.S/M Pitch0.1mm(4mil)
6Finish Hole (Mechanical)0.2mm--6.30mm
7PTH Wall Thickness>0.025mm(1mil)
8Hole Dia.Tolerance(PTH)±0.075mm(3mil)
9Hole Dia.Tolerance(NPTH)±0.05mm (2mil)
10Hole Position Deviation±0.05mm (2mil)
11Outline Tolerance±0.10mm (4mil)
12Twist&Bow≤0.7%
13Insulation Resistance>1012Ω Normal
14Through hole resistance<300Ω Normal
15Electric strength>1.3 kv/mm
16Current breakdown10A
17Peel strength1.4N/mm
18S/M abrasion>6H
19Thermal stress288 degrees20 Sec
20Test Voltage50-300V
21Min. blind/buried via0.2mm (8mil)
22Available Laminates MaterialFR-4, High TG FR-4(TG150,TG170), Aluminum Base, Halogen Free,Rogers(Ro4003,R04350,R6006)
24Out Layer Copper Thickness1oz--5oz
25Inner Layer Copper Thickness1/2oz--4oz
26Aspect Ratio8:1
27SMT Mini. Solder Mask Width0.08mm
28Mini. Solder Mask Clearance0.05mm
29Plug Hole Diameter0.2mm--0.60mm
30Impedance Control Tolerance+/-10%
31Surface FinishHASL,HASL Leadfree,Immersion ENIG,Chem. Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
32Insulation Layer Thickness0.075mm--5.00mm
33Special technologyImpedance control PCB,Blind/Buried PCB,Hard gold PCB,Aluminum PCB
   
Trademark:  XML
Model NO.:  XML-04
Shipment Terms:  Ex-Works, Fca Hk, Express Ddu
Origin:  China
Packing:  Vacuum Package, Customer′s Requirement
Type:  Rigid
Number of Layers:  4-Layers
Dielectric:  FR-4
Export Markets:  North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Company: Shenzhen X-Mulong Circuit Co., Ltd.

Click here to send inquiry

Most Popular

Quick Products